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Pecht, Michael

Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / Michael Pecht - 1st ed. - New York : John Wiley and Sons, Inc., 1993. - xviii, 426 p. : ill. ; 23 cm.

Includes index and bibliographical references

Science - General



1999-09-28

ISBN: 0471594466

Subjects--Topical Terms:
Electronics
Microelectronics

Dewey Class. No.: 621.381046