TY  - BOOK
AU  - Pecht,Michael
TI  - Integrated circuit, hybrid, and multichip module package design guidelines: a focus on reliability  
SN  - 0471594466
U1  - 621.381046 19
PY  - 1993///
CY  - New York
PB  - John Wiley and Sons, Inc.
KW  - Electronics
KW  - Spines
KW  - Microelectronics
N1  - Includes index and bibliographical references; eee
N2  - Science - General
ER  -