| 000 | 00784nam a2200241 a 4500 | ||
|---|---|---|---|
| 001 | 00005475 | ||
| 008 | 110328s1993 nyua g 000 0 eng d | ||
| 020 | _a0471594466 | ||
| 040 |
_aBD-DhIUB _cBD-DhIUB |
||
| 082 | 0 | 4 |
_a621.381046 _219 |
| 100 | 1 | _aPecht, Michael | |
| 245 | 0 | 0 |
_aIntegrated circuit, hybrid, and multichip module package design guidelines : _ba focus on reliability / _cMichael Pecht |
| 250 | _a1st ed. | ||
| 260 |
_aNew York : _bJohn Wiley and Sons, Inc., _c1993. |
||
| 300 |
_axviii, 426 p. : _bill. ; _c23 cm. |
||
| 504 | _aIncludes index and bibliographical references | ||
| 520 | 0 | _aScience - General | |
| 556 | _a1999-09-28 | ||
| 650 | 1 | 7 |
_aElectronics _2Spines |
| 650 | 1 | 7 |
_aMicroelectronics _2Spines |
| 999 |
_c7289 _d7289 |
||
| 526 | _beee | ||