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Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / Michael Pecht

By: Pecht, MichaelMaterial type: TextTextPublication details: New York : John Wiley and Sons, Inc., 1993. Edition: 1st edDescription: xviii, 426 p. : ill. ; 23 cmISBN: 0471594466Subject(s): Electronics | MicroelectronicsDDC classification: 621.381046 Subject: Science - General
List(s) this item appears in: EEE
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Item type Current library Call number Copy number Status Date due Barcode Item holds
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621.381046 P364i (Browse shelf(Opens below)) 1 Available 009177
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Includes index and bibliographical references

Science - General

1999-09-28

Electrical & Electronic Engineering